IBM develops silicon recycling technique
by Jan Harris
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IBM has developed a more efficient method to recycle scrap silicon wafers for the solar power industry.
The innovative technique involves using water and an abrasive pad to polish scrap wafers produced by semiconductor manufacturers. Around 3 million wafers are scrapped each year.
Water polishing erases any intellectual property or chip designs that could be on the wafer.
The process is carried out by a piece of machinery more usually employed to smooth the surface of production chips.
Previously, wafers would be dipped in abrasive chemicals or blasted with glass beads to remove circuitry, so the water-polishing method is more environmentally friendly.
Once polished, the scrap wafers could be turned into solar panels to generate power, helping to address a global shortage of silicon.
Scrap wafers are usually those used by semiconductor companies to calibrate or test their manufacture processes.
The wafers are re-polished after each test and eventually become too thin to use for this purpose any more, although they are still suitable for the solar industry.
IBM plans to share the technique with other chip manufacturers.
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